Physik Gö Uni Gö
Universität Göttingen

Nanoskalige Materialien

Research topics
My research at the Institut für Materialphysik (IMP) will concentrate on materials science at the nano-scale, since many open scientific questions and promising technological applications in materials physics are found at length scales of one micrometer and below. Specific topics will include understanding the stability and mechanical response of nanostructured materials and the reasons why they are different from their bulk counterparts. The main experimental methods that will be used include characterization and nanostructuring with focused ion beams, in-situ studies with electron microscopy, and micro-mechanical testing.

Recent Publications:


Volkert CA, Minor AM, Focused Ion Beam Microscopy and Micromachining, MRS Bulletin, Vol 32, pp. 389-395, 2007.

Rösner H, Parida S, Kramer D, Volkert CA, Weissmüller J, Reconstructing a Nanoporous Metal in Three Dimensions: An Electron Tomography Study of Dealloyed Gold Leaf, Adv. Eng. Mat. 9, 535-541 (2007).

Hodge AM, Biener J, Hayes JR, Bythrow PM, Volkert CA, Hamza AV, Scaling equation for yield strength of nanoporous open-cell foams, Acta Mat., Vol. 55 Issue 4, pp. 1343-1349, 2007.

Park YB, Mönig R, Volkert, CA, Frequency Effect on Thermal Fatigue Damage in Cu Interconnects, Thin Solid Films, Vol. 515, pp. 3253-3258, 2007.

Wang D, Volkert CA, Kraft O, Effect of length scale on fatigue life and damage formation in thin Cu films, Mat. Sci. Eng. A. (in press)

Maaß R, Van Petegem S, Van Schwygenhoven H, Derlet P, Volkert CA, Grolimund D, Time resolved Laue diffraction of deforming micropillars, Phys. Rev. Lett. (in press)

Volkert CA, Minor AM, eds. �Focused Ion Beam Microscopy and Micromachining�, MRS Bulletin, Vol 32, May, 2007.


Volkert CA, Lilleodden ET, Size effects in the deformation of sub-micron Au columns, Phil. Mag Vol. 86, Nos. 33�35, pp. 5567�5579, 2006.

Volkert CA, Lilleodden ET, D. Kramer, J. Weissmüller, Approaching the theoretical strength in nanoporous Au, Applied Physics Letters, Vol. 89, 061920, 2006.

Biener J, Hodge AM, Hayes JR, Volkert CA, Zepeda-Ruiz LA, Hamza AV, Abraham FF, Size Effects on the Mechanical Behavior of Nanoporous Au, Nano Letters, Vol. 6 Issue 10, pp. 2379-2382, 2006.

Parida S, Kramer D, Volkert CA, Rösner H, Erlebacher J, Weissmüller J, Volume Change during the Formation of Nanoporous Gold by Dealloying, Physical Review Letters, Vol. 97, 035504, 2006.

Park YB, Mönig R, Volkert, CA, Thermal fatigue as a possible failure mechanism in copper interconnects, Thin Solid Films, Vol. 506, pp. 321-324, 2006.

Zhang GP, Volkert CA, Schwaiger R, Wellner P, Arzt E, Kraft O, Length-scale-controlled fatigue mechanisms in thin copper films, Acta Mat., Vol. 54 Issue 11, pp. 3127-3139, 2006.

Maaß R, Grolimund D, Van Petegem S, Willimann M, Jensen M, and Van Swygenhoven H, Lehnert T, Gijs MAM, Volkert CA, Lilleodden ET, Schwaiger R, Defect structure in micropillars using x-ray microdiffraction, Applied Physics Letters, Vol. 89 (15), 151905, 2006.

Keller RR, Volkert CA, Geiss RH, Slifka AJ, Read DT, Barbosa N, Mönig R. Electrical methods for mechanical characterization of interconnect thin films. Proceedings of the Advanced Metallization Conference (AMC), pp. 643-648, 2006.

Nucci J, Krämer S, Arzt E, Volkert CA, Local Deformation Al Interconnects measured during Thermal Cycling and Electromigration, Proceedings of the 8th International Workshop of Stress Induced Phenomena in Metallization, AIP, Vol 817, pp. 310-316, 2006.


Nucci J, Krämer S, Volkert CA, Local Strains Measured in Al Lines during Thermal Cycling and Electromigration using CBED J. Mat. Res., Vol. 20, No. 7, pp. 1851-1859, 2005.

Zhang GP, Volkert CA, Schwaiger R, Arzt E, Kraft O, Damage behaviour of 200 nm thin copper films under cyclic loading. J. Mat. Res., Vol. 20, No. 1, pp. 201-207, 2005.

Schmitt W, Hill JP, Malik S, Volkert CA, Ichinose I, Anson CE, Powell AK, Thermolysis of a Hybrid Organic�Inorganic Supramolecular Coordination Assembly: Templating the Formation of Nanostructured Fibrous Materials and Carbon-Based Microcapsules, Angew. Chem. Int. Ed. 44, 2�8, 2005.

Zhang GP, Volkert CA, Schwaiger R, Kraft O, Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu. Materials Science Forum, Vol 475-479, pp. 3647-3650, 2005.


Volkert CA, Busch S, Heiland B, Dehm G, Transmission electron microscopy of fluorapatite-gelatine particles prepared using focused ion beam milling J. Microscopy, Vol. 214, Pt. 3, pp.208-214, 2004.

Mönig R, Keller RR, Volkert CA, Thermal fatigue testing of thin metal films. Rev. Sci. Inst., Vol. 75, No. 11, pp. 4997-5004, 2004.

Park YB, Mönig R, Volkert, CA, In-situ SEM observations of thermal fatigue damage evolution in Cu interconnects: Effect of frequency and overlayers, JOM, vol. 56(11), pp. 307, 2004.

Kraft O, Volkert CA, Reliability issues in MEMs related to cyclic loading conditions, ASME Proceedings MD 99, pp. 123-124, 2004.

Volkert CA, Eberl C, Mönig R, Walter M, Kraft O, 3D Analysis of Microstructures by Focused Ion Beam Microscopy, in Evolution of Deformation Microstructures in 3D (Editors: C. Gundalch et al., Roskilde Denmark), 2004.

Ho PS, Baker SP, Nakamura T, Volkert CA, eds. �Stress Induced Phenomena in Metallization�. AIP Conference Proceedings, New York, 2004.


Witt C, Volkert CA, Arzt E. Electromigration-induced Cu motion and precipitation in bamboo Al-Cu interconnects Acta Mat. Vol 51 Issue 1, pp 49-60, 2003.

Volkert CA, Heiland B, Kauffmann F, Preparation of Hard-to-Make TEM Samples using the FIB Microscope Praktische Metallographie/Practical Metallography Band XL, pp 193-208, 2003.

Zhang, GP, Schwaiger R, Volkert, CA, Kraft O, Effect of film thickness and grain size on fatigue�induced dislocation structures in Cu thin films Phil. Mag. Lett., Vol. 83, No. 8, pp. 477-483, 2003.

Krämer S, Volkert CA, Mayer J. Analysis of local strains in aluminum interconnects by convergent beam electron diffraction, Microscopy and Microanalysis, Vol. 9, pp. 390-398, 2003.

Zhang, GP, Mönig R, Schwaiger R, Volkert, CA, Kraft O, TEM Investigations of Fatigue Damage in Cu Thin Films and Interconnects, proceedings of the 9th International Conference on the Mechanical Behaviour of Materials, 2003.


Böhm J, Volkert CA, Mönig R, Balk TJ, Arzt E. Electromigration-induced damage in bamboo Al interconnects. J. Elect. Mat. Vol 31 no. 1, pp. 45-49, 2002.

Nucci JA, Straub A, Bischoff E, Arzt E, Volkert CA. Growth of Electromigration-Induced Hillocks in Al Interconnects J. Mat. Res. Vol. 17, pp. 2727-2735, 2002.

Keller RR, Mönig R, Volkert CA, Arzt E, Schwaiger R, Kraft O. Interconnect failure due to cyclic loading. AIP Proceedings of the 6th International Workshop of Stress Induced Phenomena in Metallization, American Institute of Physics, pp. 119-132, 2002.

Volkert CA. Electromigration in interconnects. Published in Encyclopedia of Materials: Science and Technology. Pergamon Press, 2002.


Kraft O, Volkert CA. Mechanical testing of thin films and small structures. Adv. Eng. Mat., vol.3, no.3, pp.99-110, 2001.

Dekker JP, Volkert CA, Arzt E, Gumbsch P. Alloying effects on electromigration mass transport. Phys. Rev. Lett. Vol 87 no. 3, pp. 035901-1 - 035901-4, 2001.

Spolenak R, Volkert CA, Ziegler S, Panofen C, Brown WL. �Reverse� stress relaxation in Cu thin films. Mater. Res. Soc. Proc. Vol. 673, pp.P1.4.1-P1.4.6. Pittsburgh, PA, 2001.